PCB Design Services
Designing a reliable, high‑performance, and industrial‑ready electronic board means orchestrating architecture, schematic, routing, EMC, thermal behavior, and supply chain considerations. At ADVANS Group, we design digital, analog, mixed‑signal, RF, and power boards for demanding industrial systems, from prototype through support for industrialization.
On this page:Electronic Board Design
Complex projects, reliable and industrial‑ready solutions
We are specialists in electronic board design: architecture, schematics, PCB layout, system integration, prototyping, validation (functional, EMC, environmental), and industrialization (DFM/DFT), all the way through manufacturing support with our EMS/PCB partners.
Our teams work on complex boards (high‑speed, DDR/PCIe, SerDes, RF, power, sensors, security, real‑time), in single‑board or multi‑board configurations, and integrate seamlessly with the group’s ASIC/FPGA, embedded software, and mechanical projects.
Our expertise spans a wide range of applications, including telecommunications, space, defense, automotive, industrial systems, and medical devices.
Electronic boards designed for performance and industrialization
Why choose ADVANS Group for your PCB design project?
Designing a robust, industrial‑ready electronic board is both a technical and strategic challenge: it requires strong PCB technology expertise, rigor, anticipation of EMC and thermal constraints, and seamless integration within the overall system.
At ADVANS Group, we bring the right expertise and methods to support your projects, whatever your challenges — performance, reliability, cost, power consumption, or time‑to‑market.
Do you have a project to launch or a specific need? Let’s discuss it today.
Expertise
Design driven by performance, reliability, and testability, with EMC/CE compliance, thermal behavior, vibration, electrical safety, MTBF, and obsolescence taken into account from the earliest phases.
Quality
Our culture of quality and confidentiality is reflected in a management system compliant with ISO 9001, ISO 14001, and ISO 27001 standards (for more details, see About > Certifications page).
End‑to‑end control
From architecture to laboratory testing and pre‑series production, with quality management adapted to your context (aerospace, automotive, medical, railway, industrial).
Risk transparency
Proactive management of critical components, lead times, EOL risks, EMC issues, and cost/complexity trade‑offs, supported by clear mitigation plans.
Multi‑ disciplinary integration
Strong synergy between electronics, FPGA/ASIC, embedded software, and mechanical design, ensuring products are designed to be manufactured, tested, and maintained.
Engagement models
We offer flexible engagement models tailored to your needs: consulting and expertise, competence centers, service centers, and fixed‑price projects.
Eco‑design principles
We believe the transition to more sustainable electronics starts at the design stage. We can integrate eco‑design principles from the earliest phases, seeking to reduce environmental impact without compromising performance.
Capacity and responsiveness
From our network of competence centers in Europe, we are able to absorb workload peaks and execute your roadmaps efficiently.
Engagement models tailored to your technical and business challenges
Expertise, flexibility, and innovation
We offer several engagement models for your electronic board design projects: staff augmentation, competence centers, design centers, or fully turnkey fixed‑price delivery.
Depending on the project scope and execution framework, PCB development projects may be eligible for the French Research Tax Credit (CIR) or Innovation Tax Credit (CII). These schemes can provide tax incentives for R&D and technological innovation activities.
Do you have a project or a question? Feel free to contact us.
Consulting
Our technical experts and consultants are involved in high value‑added assignments. Resources are managed by our business managers, while you remain responsible for delivery and project management.
Competence Center
We set up a dedicated team of engineers. Resources are managed by our business managers, while you remain responsible for delivery and project management.
Service Center
As part of a service center, in addition to setting up and managing a team of specialized engineers, we take responsibility for delivery as well as meeting cost, quality, and schedule objectives. We commit to results on activities defined in a catalog of units of work.
Fixed‑Price Project
Based on a set of specifications, we deliver the project in compliance with our cost, quality, and schedule commitments. Our design offices handle all phases of execution across a wide range of projects, from single‑discipline developments to cross‑functional initiatives involving numerous technological interactions.
Proven collaborations to ensure quality and compliance
A partner ecosystem to accelerate your projects
To design and support the industrialization of complex electronic boards, we rely on a network of specialized partners: PCB manufacturers, EMS providers, EMC/RF laboratories, component suppliers, and EDA tool vendors. These collaborations enable us to deliver optimized solutions that are standards‑compliant and ready for production.
PCB & EMS partners
We work with manufacturing and assembly partners to ensure the quality of prototypes and production runs, while meeting your cost, schedule, and certification requirements.
EDA tool vendors
We use market‑leading solutions for design and simulation: Altium Designer, Cadence OrCAD/Allegro, Siemens Xpedition, as well as SI/PI and thermal analysis tools.
Component suppliers
We collaborate with manufacturers and distributors to anticipate obsolescence risks, optimize costs, and ensure the availability of critical components.
EMC & RF laboratories
Our partner labs support us in electromagnetic compatibility (EMC), RF, and environmental testing, helping secure regulatory compliance and product robustness.
Technical support across the entire electronic board design lifecycle
From concept to validation: a complete cycle for your electronic board projects
Our teams are involved across the full electronic board design cycle, relying on proven methods, state‑of‑the‑art tools, and multi‑industry expertise. The goal: to ensure performance, reliability, and smooth industrialization — with no surprises.
From concept to board: an architecture designed to last
Design
Our engineers are involved from the very first stages to turn your requirements into a concrete design. We define the architecture, critical interfaces, and global constraints, then develop schematics and PCB layouts while anticipating performance, reliability, and industrialization challenges.
Definition of functional blocks, interfaces, and key constraints
Definition of functional blocks, critical interfaces (Ethernet, PCIe, USB, RF, etc.), key components (microcontrollers, FPGAs, DDR/Flash, DAC/ADC), constraints (power, EMC, thermal), and control strategies (clock, reset, power, security).
Schematics and technology selection
Development of schematics, power distribution networks,
high‑speed signal management,
DFM/DFT anticipation.
ADVANS Group best practices:
optimized stackups, via technologies
(via‑in‑pad, microvias), dielectric materials
adapted to the application.
PCB routing and integration
Placement and routing to ensure signal integrity,
EMC robustness, thermal dissipation, and manufacturability.
Impedance control, current loop management,
mechanical integration.
Mastered design ecosystem
Tools and technologies
Proven tools and technologies to design robust electronic boards, optimized for performance, reliability, and industrialization, and perfectly integrated into your system.
PCB CAD
- Altium Designer,
- Cadence OrCAD/Allegro,
- Siemens Xpedition.
SI/PI simulation
- HyperLynx,
- Sigrity.
Technologies
- Multi‑layer stackups,
- Via‑in‑pad,
- Microvias,
- Blind/buried vias,
- Hard Gold finishes.
Thermal analysis
- FloTHERM.
Rigorous methods, industry standards
Standards & compliance
To ensure reliable and industrial‑ready boards, we apply proven methods and comply with international standards from the design phase onward.
Methods
- Definition of functional blocks and critical interfaces,
- Early anticipation of DFM/DFT and EMC constraints,
- Routing optimization for signal integrity and thermal robustness.
Standards
- IPC (PCB design and fabrication),
- CE, UL,
- DO‑254 (aerospace), ECSS‑E‑ST‑10/20 (space), IEC 61508 (railway), ISO 26262 (automotive), IEC 60601‑1 (medical).
From prototype to production: reliability and compliance guaranteed
Industrialization & validation
After design completion, we manufacture prototypes and carry out laboratory testing: functional performance, EMC, thermal behavior, and endurance. We then prepare pre‑series builds and manage industrial transfer to secure production and reduce risks.
Prototyping and bring‑up
Rapid fabrication of initial boards,
power‑up, hardware/firmware debug,
verification of critical interfaces.
Laboratory testing
Functional tests, EMC pre‑compliance, RF measurements,
thermal analysis, endurance testing (vibration, shock),
validation of power supplies and protection circuits.
Pre‑series and industrial transfer
Preparation of the industrial documentation, test benches,
supplier qualification, and ramp‑up for
series production.
Mastered validation ecosystem
Tools and technologies
Specialized tools and equipment to validate your electronic boards, ensure reliability, and secure the transition to production, while optimizing lead times.
Laboratory equipment
- Oscilloscopes,
- RF analyzers,
- Signal generators,
- Thermal cameras.
EMC / RF testing
- Internal pre‑compliance,
- Certification preparation.
Software
- LabVIEW,
- TestStand.
Advanced methods, ensured compliance
Methods & standards
To guarantee reliable, industrial‑ready boards, we apply proven methods and comply with international standards from the earliest design stages.
Methods
- Prototyping and bring‑up of initial boards,
- Functional, EMC, RF, thermal, and endurance testing,
- Preparation of industrial documentation and test benches.
Standards
- CE, UL,
- IEC 61000 (EMC), IEC 60068 (environment),
- DO‑160 (aerospace), EN 50155 / EN 50121 (railway).
Robustness and compliance: boards ready for your critical environments
Constraints & performance
We integrate EMC, thermal, and mechanical constraints from the design phase onward and comply with industry standards (aerospace, automotive, medical, etc.). The goal is to ensure reliability, safety, and product certification.
EMC & signal integrity
Low‑EMI design, filtering, shielding,
impedance control.
Thermal management and reliability
Heat dissipation, component derating,
MTBF analysis.
Safety and compliance
Compliance with industry standards,
integration of safety and security requirements.
Mastered implementation ecosystem
Tools and technologies
Measurement tools, simulation platforms, and automated test benches to ensure design compliance before deployment.
SI/PI simulation
- HyperLynx,
- Sigrity.
Thermal analysis
- FloTHERM.
EMC techniques
- Shielding,
- Decoupling,
- Optimized routing.
Proven methods, certified quality
Methods & standards
Our practices rely on recognized standards to ensure reliability and compliance.
Methods
- Low‑EMI design and ground‑plane optimization,
- Thermal management and reliability analysis,
- Integration of safety and security constraints from the design phase.
Standards
- IPC,
- DO‑254 (aerospace), ISO 26262 (automotive), IEC 60601‑1 (medical),
- EN 50155 / EN 50121 (railway), CE, UL.
Resources to validate your designs before production
Our electronics laboratories: testing and securing your boards
Our laboratories play a key role in testing, characterizing, and validating the electronic boards we design.
They enable us to verify proper operation, anticipate EMC and thermal constraints, and prepare the transition to production under the best possible conditions.
Test capabilities
We are equipped with oscilloscopes, RF analyzers, EMC pre‑compliance test benches, thermal cameras, and endurance test setups. These resources allow us to carry out functional and environmental testing to secure the design.
Dedicated lab spaces
Our laboratories include dedicated areas for board rework, mechanical preparation, and rapid prototyping (including 3D printing for enclosures). The goal is to facilitate adjustments and accelerate validation phases.
Beyond equipment, our teams rely on a collaborative approach with other group disciplines (firmware, FPGA, software, mechanical) to deliver complete and reliable solutions.
In this video, Julien, electronic board domain lead at ELSYS Design, presents the laboratory at our Grenoble site and its capabilities, which help accelerate validation phases.
Engineering solutions for all industrial sectors
ADVANS Group operates across a wide range of industrial sectors, delivering state‑of‑the‑art engineering solutions tailored to the specific needs of each domain. Our expertise spans aerospace, automotive, defense, energy, IoT, medical devices, semiconductors, telecommunications, and many others.
Our expertise in action on high‑value technology projects
Project references
ADVANS Group supports its customers on complex electronic board design projects, combining performance, reliability, and innovation. Below are a few examples illustrating our know‑how: digital, analog, RF, IoT, FPGA, and mechatronics boards, as well as test benches, across sectors such as industry, medical, optics, and safety‑critical embedded systems.
These projects demonstrate our ability to operate from concept through validation, integrating EMC, thermal, mechanical, and regulatory constraints to deliver robust, industrial‑ready solutions.
The examples below are anonymized to protect customer confidentiality.
Signal acquisition and generation board
Development of an electronic board for an educational signal‑processing platform. The board handles analog acquisition and generation, with anti‑aliasing filtering and USB‑C communication. Embedded firmware on STM32 and a PC interface in Python. Fixed‑price project including design, PCB layout, prototyping, and validation.
High‑speed interface board
Design of a board integrating PCIe Gen2, DDR3, Ethernet, and an Artix‑7 FPGA for high‑bandwidth data exchange. Development of Linux firmware (Yocto) and DMA drivers. Multi‑domain project (hardware, firmware, microelectronics) with performance constraints and mechanical integration.
Compact system for infrared camera
Development of a highly integrated electronic system to interface an infrared sensor and multiple displays. Eight‑layer board with microvias, optimized power supply, and real‑time firmware. Objective: low power consumption and robustness in a constrained form factor.
iMX6‑based SODIMM module
Design of a SODIMM‑format system module integrating an iMX6ULL MPU, Ethernet, NAND Flash, and DDR3. Development of a Linux BSP, device tree, and test scripts. Project delivered with integration constraints and full validation.
Secure processor emulation board
Development of a complex board to emulate a secure processor on an UltraScale+ FPGA, with CPLD, STM32, and high‑speed interfaces. 14‑layer PCB, 2,500 components. Objective: enable software validation before availability of the final component.
Multi‑protocol IoT system
Design of an energy monitoring module integrating multiple radio protocols (LoRa, LTE‑M, Zigbee, BLE). Ultra‑low‑power optimized board integrated into a DIN‑rail enclosure. Hardware and firmware development with EMC validation.
Daughter card for HDLC analysis
Development of a daughter card to analyze HDLC data streams, connected to an existing FPGA platform. Objective: maximum reliability with a short delivery time. Design, layout, and manufacturing delivered as a fixed‑price project.
Image sensor test bench
Design of a board to characterize a high‑resolution image sensor. USB 3.0 and MIPI CSI interfaces, low‑noise power supplies, and thermal sensors. Firmware development and mechanical integration for an optical test bench.
Electronics for smart glasses
Development of an ultra‑compact board (2 × 1.4 cm) integrated into smart‑glasses frames. Integration of MCU, PMIC, sensors, and Bluetooth. Prototype manufacturing and customer bring‑up support.
Video sensor emulation board
Design of a board to emulate a video sensor using a Kintex UltraScale+ FPGA. High‑speed interfaces, QDR‑IV memory, and STM32. Objective: validate IPs before tape‑out. HDI 14‑layer PCB with thermal and mechanical constraints.
Test board for linear sensors
Development of a board to test two linear sensors with FPGA, DDR4, and programmable low‑noise power supplies. 10 Gbps optical interfaces. Project delivered under precision and tight schedule constraints.
Compact motor control system
Design of an electronic module for motor control in a constrained volume. Integration of MCU, FeRAM, T1S PHY, and isolated power supplies. Flex‑rigid boards, prototypes, and customer bring‑up support.
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Your questions about electronic board design – Answers from ADVANS Group
Frequently Asked Questions (FAQ)
Are you wondering about the technical challenges, key stages, or engagement models related to electronic board design? This FAQ brings together answers to the most frequently asked questions to help you better understand our expertise, our methodologies, and the solutions we offer.
Key stages
What are the key stages in the design of an electronic board?
The design of an electronic board generally follows a structured sequence of phases:
requirements analysis and specification drafting, definition of the architecture and component selection, schematic design and PCB layout, technical checks (DFM, DFT, signal integrity, EMC constraints), followed by prototyping and functional validation.
Re-design / Optimization
Can you work on an existing electronic board (re‑design or optimization)?
Yes. An existing board can be reworked to improve performance, reduce costs, address component availability issues, or adapt it to new technical, regulatory, or industrial constraints.
These interventions can range from targeted adjustments to a partial or complete re‑design.
EMC
How are EMC constraints integrated from the early stages of electronic board design?
Electromagnetic compatibility constraints are taken into account from the earliest design phases.
This includes architectural choices, management of ground and power planes, routing of sensitive signals, decoupling, and, when necessary, preparation of pre‑qualification tests for certification.
Tools & reference standards
What tools and reference standards are commonly used in electronic board design?
Electronic board design relies on specialized CAD tools for schematic capture and PCB layout, as well as on recognized reference standards for manufacturability, reliability, and compliance.
These standards notably include IPC rules, regulatory requirements (CE, UL), and environmental constraints such as the RoHS directive.
Rapid prototyping
In which cases is rapid prototyping relevant in electronic design?
Rapid prototyping is particularly useful for validating an architecture, mitigating technical risks, or accelerating debugging and bring‑up phases.
It makes it possible to obtain functional boards quickly, depending on design complexity and component availability.
Complex electronic boards
How are complex electronic board projects approached?
Complex projects often involve multi‑layer boards, high‑speed signals, and strong thermal, mechanical, or environmental constraints.
They require a global approach that integrates electronic design, advanced verification activities, and anticipation of industrialization challenges.
Eco‑design
How does eco‑design influence electronic board design?
Eco‑design principles influence certain technical choices from the design phase, notably component selection, power consumption, repairability, and board lifetime.
They are considered as a full design parameter, alongside performance, cost, reliability, and regulatory compliance.
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